LTCC设计规则(LTCC Design Rules)一——术语

发布时间:2014-12-23 08:51:25   阅读:3190
LTCC设计规则(LTCC Design Rules)一——术语
LTCC Terminology(术语)
Because of the shrinking of the LTCC tapes during the firing it is very necessary to observe various design rules. This part is based on a few design 
guides published from the following manufacturers / processors: 

DuPont: LTCC-Technology Design And Layout Guideline Green Tape System (EKP,12.8.1998);
CTS Microelectronics: Low-Temperature Cofired Ceramic Design And Layout Guidelines For The Fabrication Of Networks, Packages and Multichip Modules;
National Semiconductor: Design Rules For Physical Layout Of Low Temperature Co-Fired Ceramic Modules (Version_8.1);
Scrantom Engineering Inc.: Low Temperature Cofired Ceramic Design Guidelines (Rev. C);
Siegert electronic GmbH: Design Rules For LTCC (Rev. C);
Sorep-Erulec: General Design Guide For LTCC Substrates (8-jan-99).
All called numbers are average values and ranges and may vary from one to the other system; these rules depend on both material and process properties. 
This paper doesn't intend to describe all known design rules; it should only give an idea about the possibilities of LTCCs.

1 : Top Side External Conductor                  A : Via Cover Pad
2 : Cofired or Postfired Surface Resistor B : Via Diameter
3 : Buried Resistor C : Via Stagger
4 : Buried Via D : Via Spacing
5 : Buried Capacitor E : Via Pitch
6 : Stacked Vias F : Via Center To Part Edge
7 : Blind Via

A : Line Pitch
B : Line Spacing
C : Line Width
D : Conductor To Part Edge / Edge To Feature
E : Via To Conductor Line Spacing
F : Via Center To Part Edge
G : Line To Cavity Wall Spacing
H : Cavity Size
I : Cavity Wall To Part Edge Spacing

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