LTCC技术资料
LTCC技术资料
iLTCC.com

LTCC设计规则(LTCC Design Rules)一——术语

发布时间:2014-12-23 08:51:25   阅读:2588
LTCC设计规则(LTCC Design Rules)一——术语
LTCC Terminology(术语)
由于共烧过程中LTCC磁带的收缩,研究各种设计规则是非常有必要的。
Because of the shrinking of the LTCC tapes during the firing it is very necessary to observe various design rules. This part is based on a few design 
guides published from the following manufacturers / processors: 

DuPont: LTCC-Technology Design And Layout Guideline Green Tape System (EKP,12.8.1998);
CTS Microelectronics: Low-Temperature Cofired Ceramic Design And Layout Guidelines For The Fabrication Of Networks, Packages and Multichip Modules;
National Semiconductor: Design Rules For Physical Layout Of Low Temperature Co-Fired Ceramic Modules (Version_8.1);
Scrantom Engineering Inc.: Low Temperature Cofired Ceramic Design Guidelines (Rev. C);
Siegert electronic GmbH: Design Rules For LTCC (Rev. C);
Sorep-Erulec: General Design Guide For LTCC Substrates (8-jan-99).
All called numbers are average values and ranges and may vary from one to the other system; these rules depend on both material and process properties. 
This paper doesn't intend to describe all known design rules; it should only give an idea about the possibilities of LTCCs.
 
Terminology

1 : Top Side External Conductor                  A : Via Cover Pad
2 : Cofired or Postfired Surface Resistor B : Via Diameter
3 : Buried Resistor C : Via Stagger
4 : Buried Via D : Via Spacing
5 : Buried Capacitor E : Via Pitch
6 : Stacked Vias F : Via Center To Part Edge
7 : Blind Via
 

A : Line Pitch
B : Line Spacing
C : Line Width
D : Conductor To Part Edge / Edge To Feature
E : Via To Conductor Line Spacing
F : Via Center To Part Edge
G : Line To Cavity Wall Spacing
H : Cavity Size
I : Cavity Wall To Part Edge Spacing
 
 

上一篇:什么是LTCC?What Is LTCC?

下一篇:LTCC设计规则(LTCC Design Rules)二——值

最新发布
相关文章
版权所有 © 2012 - 2015 深圳市华源茂业科技有限公司 粤ICP备14091801号-2